Voice is quickly becoming the primary interface for consumer and enterprise devices, driven by improved speech models, small language models and the push for on-device processing to reduce latency and protect privacy. Delivering this experience requires always-on voice and audio pipelines—with features like keyword spotting, beamforming, ASR, noise reduction and immersive playback—under tight power budgets. This talk connects those requirements to silicon and software choices and introduces the sixth-generation Cadence Tensilica HiFi iQ DSP IP, designed for next-generation voice AI and immersive audio formats in markets such as smart home, mobile and automotive. We’ll explore architectural choices that enable higher efficiency and programmability—2x compute, 8x AI performance, and >25% energy savings versus HiFi 5s, expanded FP8/BF16 support and enhanced auto-vectorization—plus the developer ecosystem (NeuroWeave SDK, TensorFlow Lite Micro/LiteRT and ExecuTorch) that accelerates deployment.

